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    Please use this identifier to cite or link to this item: http://163.15.40.127/ir/handle/987654321/793


    Title: Sn-9Zn-0.1Cr/Pd-xGa 無鉛銲錫合金之潤濕性與抗氧化性質研究
    The microstructures and wetting properties of the Sn-9Zn-0.1Ti/In/Cu-xGa lead-free solder alloys
    Authors: 陳剛毅;Chen, Kang-I;鄭壽昌;Cheng, Shou-Chang;吳信賢;Wu, Sean;林光隆;(東方技術學院電子與資訊系)
    Contributors: (東方技術學院電子與資訊系)
    Keywords: 無鉛銲錫合金;Sn-9Zn;潤濕性;抗氧化;Ga
    Date: 2006-11-24
    Issue Date: 2010-05-13 20:09:46 (UTC+8)
    Abstract: 本研究主要探討在Sn-9Zn共晶合金中,添加少量元素Cr/Pd:0.1(wt%),Ga,x:0.05、0.1及0.3(wt%)對無鉛銲錫之潤濕性質及抗氧化性質之研究。實驗結果顯示,潤濕性質方面:在三元合金中,以添加Pd元素之改善優於Cr元素。添加0.05~0.3wt%Ga在Sn-9Zn-0.1Pd
    合金中,則可改善銲錫合金之潤濕力,其中以添加0.1Ga時,其潤濕力達到最高,為1.65mN。Sn-9Zn-0.1Cr及Sn-9Zn-0.1Pd其潤濕時間優於Sn-9Zn合金。氧化性質方面,添加0.05wt%Ga元素於Sn-9Zn-0.1Cr合金中,並未改善合金之氧化性質,反而變得較差。而添加0.05Ga元素於Sn-9Zn-0.1Pd合金中,則稍為可改善合金之氧化性質。由AES縱深元素分佈曲線圖發現添加Pd及Ga於Sn-9Zn合金中,可改善其抗氧化性質。
    Relation: 2006年中國材料科學學會年會
    Appears in Collections:[Department of Electronics Engineering and Computer Science] conference

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