Investigations on wettability, thermal property and microstructure for the Sn-Zn-Ag-0.01Al-xBi leadfree solders

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Title:	Investigations on wettability, thermal property and microstructure for the Sn-Zn-Ag-0.01Al-xBi leadfree solders
Authors:	鄭壽昌;Cheng, Shou-Chang;林靖翔;郭聰源;Chen, Kang-I;陳剛毅;(東方技術學院電子與資訊系)
Contributors:	(東方技術學院電子與資訊系)
Keywords:	wettability;thermal property;microstructure;lead-free solders
Date:	2006-11-24
Issue Date:	2010-05-13 20:07:32 (UTC+8)
Relation:	2006年中國材料科學學會年會
Appears in Collections:	[Department of Electronics Engineering and Computer Science] conference

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