微熱管散熱模組設計與性能評估

TFIR > Department of Electrical Engineering > conference > Item 987654321/265

Please use this identifier to cite or link to this item: http://163.15.40.127/ir/handle/987654321/265

Title:	微熱管散熱模組設計與性能評估 Design and Performance Evaluation of a Heat Sink Modulus with Heat Pipes
Authors:	陳品志 Chen, Pin-Chih (東方技術學院電機工程系)
Keywords:	高階桌上型中央處理器;熱管式散熱模組;平板型熱管;堆疊鰭片;錫焊接技術;High-end desktop CPU;heat pipe heat sink;flat plate heat pipe;stack fin;soldering
Date:	2004-10-22
Issue Date:	2009-10-13 14:31:19 (UTC+8)
Relation:	IMAPS Taiwan 2004 暨無鉛銲錫與IC封裝技術研討會 Proceedings IMAPS Taiwan Technical Symposium 2004(IEEE-CPMT/TAIPEI)
Appears in Collections:	[Department of Electrical Engineering] conference

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