本研究主要探討在Sn-9Zn共晶合金中，添加少量元素Cu、In、Mg、Si、Ti及Pd對無鉛銲錫之潤濕性、DSC與抗氧化性質之影響。實驗結果顯 示，In及Cu可促進銲錫合金之潤濕性。DSC方面：Sn-9Zn-X合金之熔點約為199℃。抗氧化性質方面：Sn-9Zn-0.1Si、Sn- 9Zn-0.1Ti、Sn-9Zn-0.1In、Sn-9Zn-0.1Cu合金優於Sn-9Zn及Sn-37Pb合金。The effects of the addition of Cu, In, Mg, Si and Ti on wettability, melting point and oxidation resistance in Sn-9Zn solder alloys were investigated. Differential scanning calorimetry (DSC) investigation reveals that the solder exhibits a eutectic temperature of around 199 degree C. The thermal gravimetric analysis (TGA) study shows it attains much better oxidation resistance than the eutectic Sn-Pb solder does at 250 degree C. In and Cu tended to enhance the wetting behavior of the solder alloys.
