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    Please use this identifier to cite or link to this item: http://163.15.40.127/ir/handle/987654321/1419


    Title: A microwave filter fabricated on the lead free piezoelectric substrate using the interdigital capacitor and bonding-wire inductor
    Authors: Weng, Min-Hang
    Yang, Ru-Yuan
    Wu, Sean
    Jhong, Shih-Bin
    Hung, Cheng-Yuan
    吳信賢
    洪政源
    (東方技術學院電子與資訊系)
    Contributors: 東方技術學院電子與資訊系
    Keywords: Circulator
    directional coupler
    RFID
    power canceling
    TX-to-RX leakage
    Date: 2008-10
    Issue Date: 2012-11-21 09:07:06 (UTC+8)
    Abstract: In this letter, a lumped-element bandpass filter (BPF) fabricated on the high-dielectric constant piezoelectric substrate using the interdigital capacitor and the bonding-wire inductor is designed and implemented. The lead-free piezoelectric substrate of Bi0.5Na0.5TiO3 (BNT) ceramics prepared by a conventional solid-state reaction method and sintered at temperatures 1100°C was used as substrate. The resonant frequency could be easily controlled by varying the lengths of silver bonding wire. The design procedure using the analysis of different bond-wire lengths of silver wire is described in this work. A lumped-element BPF with a central frequency at 0.9 GHz and a fractional bandwidth of 31.53% are fabricated and measured using the network analyzer.
    Relation: Microwave and Optical Technology Letter, Vol.50 no.10, pp.2594-2597
    Appears in Collections:[Department of Electronics Engineering and Computer Science] journal

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